JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR J-STDE, Dec This document identifies the classification level of nonhermetic solid-state surface mount Filter by document type. Reflow Profiles (per Jedec J-STDD.1). Profile Feature. Sn-Pb Eutectic Assembly. Pb-Free Assembly. Preheat/Soak. Temperature Min (Tsmin). °C. JEDEC / JEITA Joint Meeting #19 in Kyoto, Japan, September Steve Martell (Sonoscan) J-STDE. – J-STDE Officially Published December . stating that the document only covers wire bond packages was proposed . types of packages and Discussed at January Enrico e-mail – IPC question.

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This “C” revision has been updated to address intentional additions to a solder alloy and impurities in the alloy. Revision F has photos and illustrations of acceptability criteria — 86 of them new or updated. Users can insert company hedec procedures, or remove just the pages needed for a specific job to help keep the workbench clear. Proper packaging is a requirement.


The objective of the solderability test methods described in this standard is to determine the ability of printed board surface conductors, attachment lands, and plated-through holes to wet easily with solder and to withstand the rigors of the printed board assembly processes. Views Read Edit View history. IPC J-STD – Solderability Tests for Printed Boards Se indholdsfortegnelse her J-STDC prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes utilizing either tin-lead or lead-free solders.

Most of this damage is not visible on the component surface. It is not the intent of this standard to exclude any acceptable flux or soldering material; however, these materials must produce the desired electrical and metallurgical interconnection. It is a multifunctional surface finish, applicable to soldering, aluminum wire bonding, press fit connections, and as a contact surface.


Part 1 General Requirements has also been updated for ease of use and provides important direction and guidelines for all procedures.

Released with Amendment 1: Kravene omfatter konstruktioner i alle tre klasser. It has the potential to be suitable for aluminum wire bonding. IPC-SM – Qualification and Performance Specification of Permanent Fioe Mask and Flexible Cover Materials Se indholdsfortegnelse her Jedc the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system.


However, such thinner gold can only be utilized when the electrical connection is j-td-020 be made via soldering. The guidelines in this document are intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Part 2 is IPCB and the procedures include tools, materials and methods to be used in removing and replacing surface mount and through-hole components.

Moisture sensitivity level

The ENIG board surface finish is an electroless nickel layer capped with a thin layer of immersion gold. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. The document synchronizes to the requirements expressed in other j-sstd-020 consensus documents and is most often used with the material and process standard IPC J-STD J-stf-020 procedures have color illustrations to help the user understand the guide.

In extreme cases, cracks will extend to the component surface. This specification is a full-color document that is intended for use by the supplier or printed board fabricator, plating chemistry supplier, contract assembler or EMS facility and the original equipment manufacturer OEM. It may also be applicable for some press fit connections and as a contact surface. Note that, in this revision, both a single thickness range is in place and an upper limit for immersion silver thickness has been established.

All five sectional standards are included with the series: Retrieved from ” https: From there, the designer chooses the appropriate sectional standard for a specific technology. The tool also allows for modification of dimensional attributes of IPC approved land patterns. Components such as thin fine-pitch devices and ball grid arrays could be damaged during SMT reflow when moisture trapped inside the component expands.

IPC-A is the most widely used electronics assembly standard j-xtd-020 the world. Part 3 is IPCB and includes procedures for modifying assemblies and accomplishing laminate and conductor repairs. IPC J-STD – Requirements for Soldering Fluxes – includes Amendment 1 Se indholdsfortegnelse her This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections.

IPC – Printed Tyle Handling and Storage Guidelines Se indholdsfortegnelse her The industry’s sole guideline on the handling, packaging and storage of printed boards. Moisture sensitive devices are packaged in a moisture barrier antistatic bag with a desiccant and a moisture indicator card which is sealed.


Increasingly, semiconductors have been manufactured in smaller sizes. The revision also discusses the usage of thermal tabs and provides a new padstack naming convention that addresses the shape and dimensions of lands on different layers of printed boards.

IPC-D S e indholdsfortegnelse her Establishes the general requirements for documentation necessary to fully describe end product printed boards, regardless of raw material, special fabrication requirements, layer count or end product usage. Future updates can be downloaded FREE from www.

Make sure your operators, inspectors, and engineers have the most current industry consensus information. Revision E incorporates requirements for flexible cover materials used as a flexible dielectric protective layer over etched conductors and other conductive features.

This single volume includes all previously published changes and several new procedures for BGAs including reballing and flex-print repair. These are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits.

It is a multifunctional surface finish, applicable to soldering. Major topics include flex attachment, board-in-board, part-on-part, both lead-free and tin-lead criteria, component orientation and soldering criteria for through hole, SMT, cleaning, marking, coating and laminate requirements.

The immersion silver protects the underlying copper from oxidation over its intended shelf life. This is known as the “popcorn” effect. IPC-A is invaluable for all inspectors, operators and trainers. Amendment 1 corrects editorial errors as well as adds clarifying statements to many areas of the document.

The impact can range from a slight discoloration of the deposit to the pads turning completely black.

It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services EMS companies and original equipment manufacturers OEM. The IPC is supplemented by the appropriate sectional performance specification: This page was last edited on 7 Augustat In addition, the tables and appendices have been updated with the latest alloy information.

Three white papers are included to provide guidance on key topics discussed in the Standard. Soldering flux materials include the following: